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Besides the PCB, MITS have a proven track record
of achieving the fine processing thinner
than 100µm on the surface of many materials as following;
These processing consist of a lot of know-how, such as "stepping
process technology"
in Z-axis
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Silicon wafer
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Strontium titanate (100)
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Acrylic
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Even on the extremely thin
circuit board
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Glass material
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Magnified picture
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