Prototyping Printed Board Making Systems How to read the specification Featured lines The purpose of all the lineups & comparison of specification Options Processing on the special materials Multi-layer board making systems Formation of the through-hole Plating bath Through-hole pin Electrically conductive paste

Formation of the through-hole Three type of through-hole creation Method Advantage Shortcoming 1 Plating bath Applicable to multiple hole size, multiple number of pins Dependable Conductivity Waste liquid treatment is problem for it uses the chemicals. Export regulation is too difficult to export outside Japan. 2 Through-hole pin Easy Less expensive Holes number is up to 200 pieces for it needs hand operation. 3 Electrically conductive paste Ideal for the medium scale hole treatment Hand operation requires many man-hours. Storage period of the paste is short.